Device Modeling Engineer
Texas Instruments
About TI
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping about 100,000 customers transform the future, today. We’re committed to building a better future – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities and developing great minds. Put your talent to work with us – change the world, love your job!
About the Job
Join TI's elite SPICE Modeling Group and drive cutting-edge semiconductor innovation. You'll extract and optimize compact (SPICE) models for next-generation devices while collaborating with world-class engineers across analog, digital, and mixed-signal design and process technology teams. This position is based in TI's Bangalore, India office.
What You'll Do:
- Extract compact models for advanced semiconductor devices (MOS, LDMOS, DEMOS, BJT, Passives, GaN, RF, Sensors, NVM, RAM)
- Partner with designers and technologists to deploy modeling solutions for breakthrough circuit topologies
- Develop innovative model formulations for emerging device technologies
- Automate modeling infrastructure to accelerate technology development
- Develop AI/ML-enhanced models and parameter extraction methodologies
- Validate models through comprehensive measurement and analysis
The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.
Why This Role Matters:
Your modeling expertise will directly impact TI's next-generation products, from automotive to industrial to embedded applications. You will work at the intersection of process, device physics, and circuit design, solving complex challenges and delivering cutting edge solutions.
Ready to model the future? Apply today.
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Minimum requirements:
- Ph.D. in Electrical Engineering or related field
- 5+ years in compact (SPICE) modeling and semiconductor technology
Preferred qualifications:
- Expert-level experience with models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP)
- Deep understanding of semiconductor physics and circuit analysis
- Proficiency in EDA tools (Cadence), SPICE simulators (Spectre), and Verilog-A
- Strong programming skills in MATLAB/Python
- Statistical analysis of large datasets
- AI/ML expertise and TCAD experience highly valued