Analog IC Design Engineering Intern (RF Design)
Texas Instruments
Kilby Labs RF Design Intern – Heterogeneously Integrated Advanced Package Modeling
The RF Design Intern role is within Kilby Labs, the central R&D organization of Texas Instruments (TI). The lab is chartered to develop novel and innovative technologies and strategies for new business opportunities, drive next generation, differentiated technologies for existing businesses and recruit top technical talent for TI.
Responsibilities may include:
• Design of high frequency advanced package interconnects using FEM simulators
• Analyzing the measurement results of high frequency package interconnects (i.e. CuPillars, solder bumps), study of de-embedding and correlation with simulation results
• Development of a thermal model for high power advanced packages using FEM solvers
• Development of a mechanical model for advanced package structures using FEM solvers
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Minimum Requirements
• Currently pursuing Masters or PhD degree in Electrical Engineering or related field with RF Power Amplifier design background and RF/mmWave IC design experience
• Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications
• Experience with high frequency electromagnetic solvers
• Experience with thermal and mechanical models using FEM solvers
• Understanding the high frequency passive component design
• Knowledge of RF measurements and de-embedding