Packaging Engineering Intern
Texas Instruments
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See open jobs at Texas Instruments.See open jobs similar to "Packaging Engineering Intern" Discover Technata.Job Description
Change the world. Love your job.
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Put your talent to work with us as a Packaging Engineering Intern!
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Qualifications
Minimum Requirements:
- Currently pursuing an Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering.
- Cumulative 3.0/4.0 GPA or higher
Preferred Qualifications:
- Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
- Demonstrated analytical and problem solving skills
- Strong written and verbal communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
About Us
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
Job Info
- Job Identification 240003OB
- Job Category Engineering - Product Dev
- Posting Date 12/12/2024, 03:12 PM
- Degree Level High School Graduate
- Locations TAIP 13F, Hung Tai Center, 168 Dun Hua North Road, Taipei, 10548, TW
- ECL/GTC Required Yes
This job is no longer accepting applications
See open jobs at Texas Instruments.See open jobs similar to "Packaging Engineering Intern" Discover Technata.