We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.

Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.

As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.

About the Position

Kilby Labs is seeking a highly motivated and experienced Silicon Photonics High-Speed Design Engineer to be a key contributor to the development and implementation of innovative high-speed data communications solutions for cutting-edge optical products including silicon photonics ICs, optical engines, and co-packaging of optics. You will be responsible for the design, processing, and volume productization of silicon photonics high speed Tx photonic integrated circuits (PICs) and their integration within state-of-the-art datacom transceivers. The role includes working closely with process, architecture, test, and product engineering teams to ensure successful product development and launch. The role requires a creative problem-solver who can develop unique, breakthrough technologies that leap-frog the state of the art as well as contribute across various aspects of a project depending on project needs.

Responsibilities may include, but are not limited to:

• Design and optimize high-speed Si photonics modulator and transmit PIC solutions for next-generation datacom products.
• Work closely with high speed electronics, architecture, systems, and packaging design teams to develop co-designed optical engine solutions that meet system performance requirements
• Develop and implement volume-product-ready solutions that are power and cost efficient contributing to the development of the launch of datacom transceiver products
• Work closely with process and layout teams to develop PICs based on both fixed and customized Si fabrication processes.
• Plan and execute design and process optimization, characterization, and design validation for continuous improvement for volume production.
• Work with characterization and test teams to analyze performance data, identify areas for improvement, and assist with development of high-volume test procedures.
• Design and optimize other PIC components, such as waveguides, couplers, and filters.
• See designs through to mass production by collaborating with product engineering and operations teams.
• Drive cost and power reduction generational improvements.
• Participate in R&D to develop next generation photonics technologies, drive IP development.
• Present work and findings to internal and external stakeholders.

Minimum Requirements:

• Master’s or PhD degree in Electrical Engineering, Physics, Applied Physics, Photonics, Optical Communications or related field.
• 5+ years of industry experience designing Si photonics high-speed modulator PICs, including modeling and designing advanced high-speed Si MZMs, for datacom transceiver qualified volume products.
• Deep understanding of silicon photonics high speed device physics and fabrication processes.
• Strong understanding of PIC design, layout, and fabrication, and experience contributing to or leading PIC tapeouts.
• Familiarity with advanced modulation formats (e.g. PAM4) and linearization techniques.
• Experience with photonic design and CAD tools.
• Experience with characterization and testing of high-speed photonic devices.
• Ability to work both independently and as part of a team.

Preferred Qualifications:

• Experience with a range of modulator technologies e.g. Si ring resonator (MRR) modulators, EAM modulators, and non-Si modulator materials.
• Experience with co-design of photonics with analog-front-end electronics.
• Experience with technical approaches for next-gen (beyond 200 Gb/s/lane) modulator technologies and modulation formats.
• Experience with TOSA optical engine design and packaging and assembly of photonic devices.
• Knowledge of optical communication systems and standards.
• Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations.