Optical Packaging Engineer

Location: Dallas, TX or Santa Clara, CA

Group: Kilby Labs

We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.

Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.

As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.

About the Position

Kilby Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and implementation of innovative packaging solutions for cutting-edge optical products including silicon photonics ICs, optical engines, and co-packaging of optics. The role requires a creative problem-solver who can develop unique, breakthrough technologies that leap-frog the state-of-the-art as well as contribute across various aspects of a project depending on program needs.

Responsibilities may include, but are not limited to:

• Own optical package designs and requirements and maintain quality of existing solutions for a range of optics related products.
• Define and develop new packaging processes and approaches to meet system specifications including for advanced silicon photonics products.
• Develop solutions for low-loss, low-cost and scalable fiber-to-chip packaging.
• Design and develop Heterogenous Integration (HI) assembly processes for photonic and electronic integration.
• Multiphysics modelling of thermal, mechanical and optical properties and performance.
• Lead integrity and yield analysis and drive improvement/corrective actions for silicon process and semiconductor assembly packages utilizing appropriate tools.
• Plan and execute process optimization, characterization, design validation, and failure analysis.
• Collaborate with external partners to realize packaging solutions and manage vendor relationships.
• Consider cost effectiveness and perform cost effectiveness studies, develop and introduce package cost reduction programs.
• Maintain product quality, develop and lead package qualification programs.
• Ensure mass production readiness by collaborating with engineering and operations teams.
• Present work and findings to internal and external stakeholders.

Minimum Requirements:

• Master’s degree or higher in electrical engineering, mechanical engineering, material science or related field.
• 5+ years of relevant experience in semiconductor package/process development, including modeling, test development, device/module qualification.
• Direct experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips.
• Experience in semiconductor packaging technology, including die attach, wire bonding, flip-chip, and micro-optics.
• Strong understanding of device physics, materials, and thermal/mechanical analysis.
• Optical, mechanical, thermal and electromagnetic modeling and characterization of packages and optical systems.
• Knowledge of industry optical packaging competitive landscape, trends, industry standards, supply chain, manufacturing equipment and reliability requirements.
• Demonstrated analytical and problem-solving skills.

Preferred Qualifications:

• Experience with fiber handling, fiber cleaving, wet processing, fiber connectors.
• Experience with Optical and electro-optical characterization and probing.
• Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers.
• Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations.