We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

An experienced thermal design engineer with a passion for cutting-edge technology and innovation. You have a deep understanding of thermal analysis and modeling, including conduction, convection, and radiation. You are adept at setting up simulation environments with the proper boundary conditions and can evaluate design tradeoffs to ensure readiness for sign-off. You possess strong coordination and partnership skills, and you’re comfortable working cross-functionally with various teams to translate thermal specifications into design requirements. You are detail-oriented, self-motivated, and have excellent organizational and planning skills. Your strong communication and presentation abilities enable you to effectively coordinate engineering projects and collaborate with executive teams. You thrive in a dynamic environment and are excited about the opportunity to shape the future of 3DIC packaging solutions.

What You’ll Be Doing:

- Running thermal simulations to evaluate design tradeoffs and ensure designs are ready for sign-off. - Architecting plans for modeling multiple side-by-side and stacked devices on silicon interposers with chiplets and optical components. - Working cross-functionally with Synopsys’ IP teams to translate thermal specifications into design requirements. - Utilizing tools such as Ansys ICEPAK, Redhawks SCET, and others for thermal analysis and modeling. - Selecting appropriate Thermal Interface Materials (TIM), epoxies, underfills, etc., based on material thermal properties. - Designing heatsinks, heat pipes, heat chambers, fans, and other thermal solutions.

The Impact You Will Have:

- Ensuring the thermal reliability and performance of 3DIC packaging solutions for leading-edge applications. - Contributing to the successful integration of Synopsys’ IP portfolio into high-performance silicon chips. - Enhancing the thermal management of optoelectronics and other advanced technologies. - Driving innovations in thermal design that support the development of next-generation data center and AI/ML solutions. - Collaborating with cross-functional teams to achieve optimal thermal designs and meet project goals. - Supporting the continuous improvement of thermal analysis and modeling methodologies within Synopsys.

What You’ll Need:

- MS/Ph.D. degree in Mechanical, Material Science, or Electrical Engineering. - 5+ years of experience in the Thermal Engineering field. - Proficiency in using Ansys ICEPAK and Redhawks SCET. - Strong knowledge of material thermal properties and selection of Thermal Interface Materials (TIM), epoxies, underfills, etc. - Experience in system-level thermal simulation of enclosures, airflow, and fluid dynamics.

Who You Are:

- Self-motivated and detail-oriented. - Strong organizational and planning skills. - Excellent communication and presentation skills. - Ability to work collaboratively with cross-functional teams. - Innovative mindset with a passion for cutting-edge technology.

The Team You’ll Be A Part Of:

You will be part of a dynamic team that designs cutting-edge packaging solutions for the industry’s leading 3DIC customers in the datacenter and AI/ML space. This team collaborates closely with Synopsys’ IP teams and other engineering groups to deliver high-performance, thermally optimized solutions.

Rewards and Benefits:

"We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process."

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.