Engineering Technician 5 (Assembly)

Primary Responsibility will be to support New Product development and assembly of engineering prototype builds.

Tasks include:

Work with Engineers on Multi-Chip Module (MCM) product assembly and development

Perform programming, setup and operation of stencil screen printer, reflow oven, surface mount (FUJI NXTIII), auto die attach (Datacon), Molding (TOWA), marking and dicing saw (Disco)

Create auto wire bond programs and loop profiles in K&S Maxum bonder. Support wire bond process characterization and optimization to achieve desired test performance and wire bond specification. Record and document results for repeatability and production readiness

Responsible for assembly lab equipment setup, parameter settings, process verification, and maintenance

Perform manual die pick and placement using tweezers or pickup tools, epoxy / DAF attach on MCMs. These tasks are a combination of manual assembly and equipment operation and involve working with the aid of a microscope and tools for handling very small parts for prototyping

Support customized build request, mount MCMs on evaluation boards by solder attach. Perform manual soldering, attach passive components, perform rework on boards, change components, mount dies, and wire bonding

Candidate must be able to work from schematics, diagrams, written and verbal descriptions, layouts or defined plans to perform assembly functions. Candidate must know how to interpret builds and BOM (Bill of Material). A basic understanding of electronic circuits is required. Must be proficient using hand tools such as tweezers, picks, vacuum pencils. Understanding die bonding, wire bonding, flip chip assembly and test fixtures is also desired.

Candidate should take an active role in the building of new products, participating in meetings, and being a team player. This position requires a self-motivated team player with a strong desire to succeed. Must have team-oriented attitude, accountability and ownership.

Job Requirements:

Associate degree or equivalent years of experience 3+ years.

Strong experience in IC assembly process technology, operation and maintenance of assembly tools.

Work from Schematic drawings for assembly builds and follow specifications for qualification of new designs

Experience with hand tools (e.g., Tweezers, Vacuum pickup tools, Soldering Irons, die handling, test fixtures)

Experience with computers using Microsoft excel, word, power point and Microsoft outlook.

Preferred Skills:

Stencil screen print, SMT, reflow, manual die attach, wire bonding, molding, marking, dicing saw, soldering and printed circuit assembly experience, working from engineering drawings, and markups. Trained to handle ESD sensitive electronic components, and experience working with the aid of a microscope.