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Sr. Packaging Engineer

Semtech

Semtech

Software Engineering
Hyderabad, Telangana, India
Posted on Jul 2, 2025

Responsibilities:

  • Develop new packages and processes to support new product launches on time. (50%)

  • Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)

  • Troubleshoot and Support production related packaging issues. (20%)

  • Designing new packages, layout of lead frame and substrate panels.

  • Run risk analyses for new product scenarios.

  • Debug subcon production issues.

  • Make design and process decisions to achieve best in class new product realization.

Minimum Qualifications:

  • B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering

  • 8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team

  • Excellent analytical and trouble shooting skills with the ability to proactively solve issues

  • Effective verbal and written communication to interface at all levels within the organization

  • Strong sense of urgency to meet product requirements on schedule

  • Experience in working with international and cross-functional teams

  • AutoCAD package design is required. SolidWorks and Thermal simulations are plus.

  • Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project