Description

• Responsible for improving/developing existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints. Primarily Wirebond, Die Bond & Mold processes.
• Responsible for Developing new assembly technologies such as:
• Hybrid Wire Bonding (Al Heavy & Fine Wire Ultrasonic Bonding combined with Cu/PCC & Au Heavy Wire Bonding), Ribbon Bonding.
• Stacked Dice & Bridged Die Bonding on Leadframe Pad and DBC, Clip Bonding
• High CTI, high Thermal, Low Stress Vacuum assisted Molding Technologies
• Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
• Drive alignment between GaN Power Discrete design requirements and supplier capabilities, to enable new product development and volume manufacturing of GaN Power Discrete products
• Run process DOE’s to define optimum process windows and material characteristics on existing assembly processes and for new package development
• Define and Drive reliability testing and qualification of new Power Discrete packages in conjunction with the reliability group
• Work closely with OSATs, Materials & Equipment supplier partners to improve existing processes and to develop new processes for new Products
• Work closely with New Product Definition teams to define packages to meet their requirements
• Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production

• BS Degree in ECE, EE, ME, ChemE, CompE, Material Science
• Minimum15 years of experience in Semiconductor Assembly as Process Engineer, Process Development Engineer & Package Development Engineer : Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and DTFS & Package Singulation
• Excellent people & leadership skills and experience in dealing with & managing OSATs for at least 5 years.
• Substantial experience in Power Discrete Products with Multi Die & Stacked Die configuration, Ag Sintered Die Bonding, Al, Cu/PCC & Au Wirebonding Technologies and Low Stress Vacuum Molding
• Can perform actual hands on Process Capability Analysis & Risk Prediction, Design of Experiments, Variability Charting, Analysis of Variance/Means Comparison/T-Tests from raw data using SAS.JMP or Mini Tab Software. Preferably Green Belt Six Sigma Certified as a minimum
• Experience with latest material technologies : Sapphire Substrate Sawing, Conductive & Non Conductive High Thermal Die Attach Film, Ag Sintered Epoxies, Clip Bonding, Ribbon Wire Bonding, High CTI, High Thermal, High Tg, Low Stress, Fine filler Molding Compounds
• Experience with IC Packaging design rules, tools (including AutoCAD)
• Knowledge of AECQ Automotive reliability requirements, APQP automotive development process, JEDEC Design standards.
• Ability to work in a fast-paced, high stress environment with high rates of change
• Able to work with people in the US & Europe timezones