Description: The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP’s business lines. This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis logic/RF devices. The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.

The key areas of responsibility of the jobholder are:
- Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes.
- Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior.
- Interface with internal and external stakeholders on critical development and transfer projects.
- Lead and steer projects to meet timelines and business objectives.
- Make key decisions on process integration, balancing technical, logistical, and strategic factors.
- Support NTI process transfers within foundries and NXP joint ventures

Requirements / preferences:

- Bachelor’s or Master’s degree in Electrical Engineering, Physics, or related field.
- Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices.
- Proven hands-on experience with HKMG and FinFET technologies in production or development environments.
- Deep understanding of semiconductor device physics, especially HKMG and FinFET.
- Strong analytical skills in yield enhancement and electrical data analysis.
- Fluent in English and Mandarin.
- Demonstrated leadership in development, transfer, or ramp-up projects.
- Excellent communication and influencing skills.
- Proactive, pragmatic, and results-driven mindset.
- Experience working with foundries and leveraging external manufacturing capabilities .

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