Responsibilities:
• Response in front of line process that major process are wire bonding, plasma and AOI.
• Perform process control and sustaining , quality and yield improvement.
• Problem analysis base on 5M 1E to find out corrective actions and support production, perform trouble shooting in production
• Design and develop wire bond recipe to optimize quality, delivery and cost improvement.
• Find and optimize tool that use at wire bond example capillary, top plate window clamp.
• Support quality buy-off for equipment and tool qualification.
• Support NPI/NTI projects qualification for selective projects.
• Create and maintain documentation for process control, set standard working.
• Understand change matrix, develop and doing evaluation reports for process capabilities improvement.
• Support internal and external audit, factory visit.
• Provide problem analysis report and 8D report in case factory escape or customer complaint.
• Collaborate with cross-functional team for problem solving, quality disposition and improvement projects

Qualifications:

• Bachelor's or master's degree in electronic, electrical engineering or related field.
• New graduates or candidates with up to 2 years of experience in wire bond process or semiconductor industry are encouraged to apply
• Proven track record in optimizing manufacturing processes using Lean Six Sigma.
• Strong skills in SPC tools, Cpk analysis, and DoE techniques.
• In-depth understanding of semiconductor failure analysis and majority wire bond process.
• Experience in processing documentation
• Effective communication both Thai and English and organizational abilities.
• Proactive mindset with project management skills.
• Able to work under pressure.
• Able to work and manage multiple tasks

More information about NXP in Thailand...