Assembly Back End Process Engineering Sr Manager
NXP Semiconductors
An Assembly End-of-Line Process Engineering Senior Manager leads and optimizes the final stages of product assembly, focusing on efficiency, quality, and cost. They manage a team, oversee projects, and implement improvements to ensure products are assembled and delivered within specifications, budgets, and timelines.
Key Responsibilities:
Team Leadership & Development:
Selecting, leading, directing, evaluating, and developing a team of engineers and technical staff to ensure project completion. This includes mentoring, training, and performance management.
Project Management:
Planning, prioritizing, and managing projects related to assembly line improvements, new equipment installation, and process optimization.
Process Analysis & Improvement:
Analyzing existing assembly processes to identify areas for Yield/Quality/Cost/Hold Lot improvement, developing and implementing solutions to enhance efficiency and reduce errors
Cost Management:
Managing budgets, tracking costs, and ensuring projects are completed within allocated resources.
Supplier Management:
Leading interactions with suppliers regarding equipment and technologies for the assembly line.
Collaboration & Communication:
Working closely with cross-functional teams (production, quality control, logistics, etc.) to ensure seamless integration of new processes and technologies.
Quality Assurance:
Ensuring that products meet quality standards and customer specifications.
Technical Specification & Documentation:
Writing technical specifications for new equipment and processes.
Problem Solving:
Analyzing and resolving issues related to the assembly line, including root cause analysis and elimination.
Performance Tracking:
Establishing and monitoring key performance indicators (KPIs) to track process effectiveness and drive continuous improvement.
Qualifications:
Bachelor's or Master's degree in Engineering (Mechanical, Manufacturing, Chemical, etc.).
10-15 years of experience in process engineering, assembly engineering, or a related field.
Strong leadership, project management, technical, and communication skills.
Familiarity with assembly processes, manufacturing systems, quality control methods, and relevant standards (e.g., IATF 16949, VDA).
Technical Skills: EOL Process knowledge Mold, Package Saw, Trim and Form, Deflash, Package AOI, Mold compound.
Experience with QFN, SO, and TSSOP packaging will be an advantage.