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Assembly Engineering Senior Manager

NXP Semiconductors

NXP Semiconductors

Kuala Lumpur, Malaysia
Posted on Jun 3, 2025

- Member of cross-site Assembly Engineering Team

- Reporting to Director Assembly Engineering

- Responsible for key Die Attach processes: MCM, Epoxy, DAF, WBC, FoW. (Knowledge in Solder and Eutectic DA is a plus)

- Responsible for key WLCSP/Die Sort processes: Wafer to Wafer, Wafer to T&R– FFC/Bakelite/waffle pack/gelpak experience. (Knowledge in Side Wall & Laser Groove area IR Vision is a plus)

- Knowledge of SMT process & vision and temperature curing oven experience is required.

  • Process or Equipment engineer with 10 years’ experience or more.
  • Equipment automation /integration related experience will be added advantage.
  • Project management experience will be an advantage.
  • Liaise with all 4 Factory Engineering teams and ensure cross-site coordination.
  • Define/enable process flow and quality standardization (in partnership with IE)
  • Drive OEE, cost and productivity improvement initiatives (in partnership with IE)
  • Best practices deployment to all 4 backend factories.
  • Die Attach & WLCSP/Die Sort equipment expert: partner to APEX, IE, Package Innovation teams.
  • Chair of APEX Die Attach & WLCSP/Die Sort User Group.
  • Ensure that Equipment install base and capability are aligned with Package Roadmap.
  • Coordinate cross-site process, applications evaluations
  • Supervise equipment benchmarking at backend sites.
  • Support install base pruning.
  • Address customer incidents associated to assembly and test equipment and
  • resolve at source. (firefighting/ future fire prevention)
  • Other responsibilities may be assigned over time as needed and applicable.
  • Process, Equipment or RQC, engineer: minimum 10 years’ experience with hands-on equipment optimization, new product release and productivity improvement.
  • Strong Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
  • Advanced knowledge of process, materials and semiconductor packaging technologies
  • Able to write and review detailed product requirements
  • Project management experience: past direct project leadership responsibility from project definition to conclusion phase.
  • Previous direct project work with suppliers on quality or productivity improvement projects is a must.
  • Cross cultural work experience

Education:
- Bachelor’s Degree in Engineering or Science in technical discipline.
- 6 sigma green belt or above certified recommended.

Working style:
- Good communication skills, knowledge in multi-languages will be an advantage.
- Self-motivated working style & able to work independent, delivery of KPI’s expected.
- Possess good collaboration skills & ability to promote strong teamwork across multi-cultural teams.
- Ability to travel as need arises to support cross site projects


More information about NXP in Malaysia...

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