• Plan and execute projects to improve cost, yield, quality and productivity of products in his/her portfolio.

• Analyze and resolve technical issues and challenges in Fab, Probe, Assembly, Test, and Design – working closely with global product, design, wafer fab process, device engineering and manufacturing teams.

• Perform ATE test software programming, debugging and electrical failure analysis

• Carry out test insertion reduction, parallel test conversion, test platform transfers, and development of innovative test methodologies.

• Perform qualification of product changes, wafer fab transfers, and new package release.

• Lead yield improvement, productivity and cycle time improvements.

• Support of production lot disposition, determine root cause and fixes.

• New product/process introduction, develop procedures and process controls for high volume manufacturing.

• Develop production training materials and OCAPs.

• Manage & support extended factory products testing/LOH disposition/CIP

Job Qualification

• Master's/Bachelor's degree in Electronics or Electrical Engineering, preferably with less than 2 years of relevant working experience.

• Proven skills in failure analysis, test software programming, statistical analysis, and/or test methodology development (e.g. DFT) are highly desirable.

• Knowledge of ATE Test a plus, especially for Ultraflex-1600 or Teradyne J750 Test systems.

• Knowledge of Semiconductor Manufacturing is an added advantage.

• Knowledge of mixed signal and/or digital test techniques for microprocessors, microcontrollers, memories and DSP is an advantage.

• Knowledge of UNIX, Perl, C/C++, and assembly language programming is an added advantage

• Knowledge of Automated skillset and Machine Learning is an added advantage

• Fast learner to meet skills requirement for new and advancing VLSI product testing.

• Good communications skills.

More information about NXP in Malaysia...