Job Responsibilities:

• His/her responsibilities includes all aspects of wafer Fab manufacturing, including line yield, cycle time, capacity flexibility, quality (automotive included), cost reduction, excursion prevention and resolution.

• He/She may lead technology qualification (including technology transfers), production ramp up, yield enhancement and steer projects towards timely completion to support NXP business needs with close collaboration with foundries and NXP internal stakeholders.

• He/She will be expected to be the main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics etc. In addition, he/she will be the focal points of supplier management, developing deep relationships with third party management and engineers.

Job Qualification

• Bachelor or MSc in physics or electrical engineering.

• In-depth knowledge of IC devices and processes.

• >10 years of experience with front-end IC process integration, working in foundries’ production or development teams

• Hands on experience in being a lead; leading teams with responsibilities in transfer or sustaining projects during production

• All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead.

• Good data analytical and people communication skills.

• Pro-active working attitude, creative, pragmatic, enterprising and result driven.

• Having the ability to influence and steer a discussion.

• Familiar in managing/working with foundries, maximising leverage from foundries.

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