• Plan and execute projects to improve cost, yield, quality and product productivity.
• Support product lot on hold, analyze and work with related parties to determine root cause and fixes.
• Analyze and resolve technical issues and challenges in Fab, Probe, Assembly, Test, and Design – working closely with global product, design, wafer fab process, device engineering and manufacturing teams.
• Support and qualify NPI (new product introduction) activity.
• Perform ATE test software programming, debugging and electrical failure analysis

Job Qualification

• Master's/bachelor's degree in Electronics or Electrical Engineering, 0 - 2 years of working experience in related field.
• Knowledge of statistical analysis to perform engineering data analysis and draw conclusions from data using statistical tests
• Knowledge of UNIX, Perl, C/C++, and assembly language programming is an added advantage
• Knowledge of ATE Test a plus, especially for Teradyne J750/Uflex Test system is an added advantage.
• Knowledge of Semiconductor Manufacturing is an added advantage.
• Fast learner to meet skills requirement.
• Good communications skills.
• Able to work independently in a fast-paced manufacturing team environment.

More information about NXP in Malaysia...