• BGA - Equipment Engineer managing wire bond and WB AOI equipment.
• In-charge / holding primary role to drive for Wire Bonder & WB AOI Machines good performance to meet good quality product, output and cycle time.
• Collaboration with API and NPI team on new product equipment set up and buy off.
• Leading a group of wire bond technician to maintain machine performance through preventive maintenance and predictive maintenance.
• Monitor equipment indices and improvement plans to continue improve machine Downtime/MTBA/PM success rate.
• Responsible for equipment incurred quality incident investigation & CAPA.
• In-charge for new bonder, new software installation, buyoff & qualification.
• Responsible for equipment related document release & update (WI, ERA, PM & etc.).
• Involve in all the quality audits (GMA, IATF, Customers) and & 5S audit.
• Support department automation project at wire bonder & AOI machine.
• Identify and mitigate risk areas where the equipment or the methodologies in maintaining the equipment can cause quality or productivity problems.

Requirements

• Bachelor of Engineering (Hons) in Electrical / Mechanical / Mechatronic.
• Fresh Graduate / 1-2 years of working experience in wire bond (preferably Cu wire).
• Able to read, write and converse in English and Bahasa Malaysia.
• Equipment experience with KNS wire bonder (ICONN series & RAPID) / wire bond AOI machine.
• Able to do presentation to a big group of employees.
• Experience in DMAIC, 5 Why, FTA analysis tool & EFMEA.
• Strong knowledge in equipment stability (MTBA/MTBF, OEE & Equipment Cpk)
• Have a good interpersonal skill & able to work independently with minimum supervision.
• Strong knowledge in Microsoft Office (Word excel, PowerPoint)
• Artificial Intelligence(AI),Power BI and/or SAP background will be an advantage.

More information about NXP in Malaysia...