Responsibilities:

1. Pre-assembly equipment, grinding, sawing, laser grooving ...

2. Sustain and troubleshoot issues with high-tech equipment.

3. Improve and enhance the efficiency and productivity of equipment.

4. Plan and execute the analysis or defect detection projects.

5. Communicate with cross-functional engineers or vendors.

Qualifications:
1. Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields.
2. Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus.
3. Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English.

More information about NXP in Greater China...