Responsibilities:

• Plan and execute projects to improve cost, yield, quality and productivity of products in his/her portfolio.
• Analyze and resolve technical issues and challenges in Fab, Probe, Assembly, Test, and Design – working closely with global product, design, wafer fab process, device engineering and manufacturing teams.
• Perform ATE test software programming, debugging and electrical failure analysis
• Carry out test insertion reduction, parallel test conversion, test platform transfers, and development of innovative test methodologies.
• Perform qualification of product changes, wafer fab transfers, and new package release.
• Lead yield improvement, productivity and cycle time improvements.
• Support of production lot disposition, determine root cause and fixes.
• New product/process introduction, develop procedures and process controls for high volume manufacturing.
• Develop production training materials and OCAPs.
• Manage & support extended factory products testing/LOH disposition/CIP

Requirements:

• Master's/Bachelor's degree in Electronics or Electrical Engineering, preferably with a minimum of 1-2 years' of relevant working experience.
• Proven skills in failure analysis, test software programming, statistical analysis (JMP/Minitab), and/or test methodology development (e.g. DFT) are highly desirable.
• Knowledge of ATE Test a plus, especially for Advantest PS1600 and Teradyne UP1600/UFLEX+ Test systems.
• Knowledge of Semiconductor Manufacturing is an added advantage.
• Knowledge of UNIX, Perl, C/C++, and assembly language programming is an added advantage.
• Good communication skills, self-motivated, result oriented and comfortable working either as an individual contributor or in a team.

More information about NXP in Malaysia...