Hardware Product Engineer

Board Solutions is a central team within NXP’s CTO organization responsible for design, manufacturing, compliance and supply chain operations of PCB boards. The organization provides a one stop solutions to all business lines within NXP through its global presence in US, EU, and Asia. Business Lines include Advanced Analog, Automotive Embedded Systems and Secure Connected Edge.

We now offer the technical position of Hardware Product Engineer Intern for NXP’s Board Solutions in Shanghai, responsible for all aspect of the product development cycle from the concept and design to manufacture, packaging, delivery and quality of the hardware products.

Responsibilities:

• Responsible for ensuring products meet all mechanical requirements, including boards, cables, enclosures and systems

• Develop new socket for silicon test based on test requirements, such as, reliability socket, silicon validation socket, FA socket, etc.

• Design new package for NPI product packing

• Collaborate with design engineer, CAD Layout and test engineer to release system solutions that adhere to DFM guidelines and meet schedule requirements

• Review layout requirements, layout, Gerber, and BOM data to ensure component population is accurate and corresponds to contract manufacturer (CM) processes, industry standards and compliance

• Incorporate with CM production line equipment, process capability to perform DFM review activity to optimize layout components placement.

• Generate Change Orders and Corrective Actions to release product engineering data for NPI and sustaining products. Changes should incorporate feedback from contract manufacturers (CMs). Release board assembly instructions documents to guide CM assemble board, assemble board with enclosures, take caution on some key points during assembly.

• Responsible for identifying and communicating manufacturing risks & resolutions to BL partners and project team. Perform board assembly feasibility & risk analysis for specific board assembly process from BL TRD (technical requirements), such as press-fit, ultrasonic clean, conformal coating, underfill process.

• Be familiar with PCB assembly process, such as SMT, de-panel, wave solder/selective wave solder, press-fit, conformal coating, underfill, etc.

• Perform First Article and incoming inspection for PCBA & mechanical parts and assemblies

• Interact with CMs to resolve assembly and manufacturing issues, improve yields for NPI and sustaining products

• Ensure engineering data is complete and approved by all stakeholders and input build packages into Aras manufacturing database for each product release

• Comprehensive knowledge of BOM structure and change control processes

• Work cross functionally to ensure the resolution of problems and actions as needed

Requirements:

• Bachelor or Master’s degree in electronics, product & industrial design, mechanical design or related field

• Experience in one or more of the following areas is a plus: PCB fabrication, PCB assembly, PCB DFM/DFA, Component Engineering, Mechanical Design, Thermal Simulation, Product Lifecycle Management

• Experience with CAD software such as AutoCAD, Solidworks, Pro-E, CAM350, Allegro, Graphicode, etc. is a plus

• Excellent interpersonal and communications skills, English proficiency, good teamwork adaptability, self-motivation

More information about NXP in Greater China...