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Test Product Engineer

NXP Semiconductors

NXP Semiconductors

Kuala Lumpur, Malaysia
Posted on Thursday, July 11, 2024


  • Plan and execute projects to improve cost, yield, quality and productivity of products in his/her portfolio.
  • Analyze and resolve technical issues and challenges in Fab, Probe, Assembly, Test, and Design – working closely with global product, design, wafer fab process, device engineering and manufacturing teams.
  • Perform ATE test software programming, debugging and electrical failure analysis
  • Carry out test insertion reduction, parallel test conversion, test platform transfers, and development of innovative test methodologies.
  • Perform qualification of product changes, wafer fab transfers, and new package release.
  • Lead yield improvement, productivity and cycle time improvements.
  • Support of production lot disposition, determine root cause and fixes.
  • New product/process introduction, develop procedures and process controls for high volume manufacturing.
  • Develop production training materials and OCAPs.
  • Manage & support extended factory products testing/LOH disposition/CIP


  • Master's/Bachelor's degree in Electronics or Electrical Engineering, preferably with a 3 years' of relevant working experience.
  • Proven skills in failure analysis, test software programming, statistical analysis, and/or test methodology development (e.g. DFT) are highly desirable.
  • Knowledge of ATE Test a plus, especially for Advantest 3324/26, HP83000/93000, PS1600, or Teradyne J750 Test systems.
  • Knowledge of Semiconductor Manufacturing is an added advantage.
  • Knowledge of mixed signal and/or digital test techniques for microprocessors, microcontrollers, memories and DSP is an advantage.
  • Knowledge of UNIX, Perl, C/C++, and assembly language programming is an added advantage
  • Fast learner to meet skills requirement for new and advancing VLSI product testing.
  • Good communications skills.

More information about NXP in Malaysia...