The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application. Package Innovation is a multi-national organization. Development implicitly involves working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.

Packaging is becoming more and more a challenge as customers in both the Automotive and the Security & Connectivity domain continuously raise the bar for performance, time-to-market, quality and cost. In this space, the package is not only an envelope to protect the silicon from the environment and allow it be mountable in the application, it has the potential to be a clear differentiator in the market.

For our Advanced Analog (AA) and Radio Frequency (RFP) portfolio, we are looking for a packaging engineer, located in Nijmegen, the Netherlands. You will lead packaging projects from idea to full release in high volumes as well as the opportunity to learn all technical aspects on the dynamic and fast evolving packing platforms and roadmaps. You will have the opportunity to shape our products through packaging projects and hence NXP’s business from a Technology Innovation point of view. With your knowledge and experience you will provide Best-in-Class Technology in all aspects – Quality, Performance, Integration and Cost of Ownership.

Key responsibilities

• As project lead, drive and execute packaging development projects with all its sub projects globally. Responsible for execution: both on time delivery and quality of deliverables
• Grow towards technical expert in the various packaging platforms and contribute towards highly innovative packaging solutions.
• Organize team meetings to keep track of progress and report out in different levels of the organization. Review project progress with key stakeholders, including those at the executive level.
• Influence and interact with line managers from Technology and Operations: Package Innovation and Manufacturing as well as Product teams to define and execute on a roadmap for package development
• Actively manage stakeholders, i.e. BL, CTO, NXP internal and external factories that are on various locations and time zones; US, Europe and Asia

Your Profile

• Bachelor or Master’s degree in Mechanical Engineering, Electrical / Electronic Materials Engineering, Physics or Industrial/Process Engineering
• Motivated, energetic, result-oriented entrepreneur with a strong drive for results
• Willingness and drive to become technical expert in packaging solutions.
• Analytical skills, come up with creative ideas
• Self-starter with strong organisational skills
• Fluent in English language both oral and written
• Excellent communicator, influencer and networker
• People person and team player, strong interpersonal skills

Affinity with following aspects is considered a pre:

• Experience in managing projects relating to Semiconductor products
• Knowledgeable on Semiconductors Packaging Technology Development
• Experience in six sigma, statistics, 8D methodology and risk management

NXP Introduction:

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets.

For more information, please visit our website https://www.nxp.com

Career Development Opportunities

Bright Minds. Bright Futures.

We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.

Visit our careers website for more job information.

Commitment At NXP.

We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Diversity, Equality and Inclusion | NXP Semiconductors

More information about NXP in the Netherlands...