Mechanical Packaging Engineer Co-op
Nokia
United States
Posted on Dec 13, 2025
Number of Positions: 1
Date: May 2026 - Aug 2026
Duration: 4 months
Location: Onsite in Sunnyvale, CA or New York, NY
EDUCATIONAL RECOMMENDATIONS
Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.
Advancing connectivity to secure a brighter world.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
About the Business Group
A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions.
We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
Some of our benefits for students in the US:
- Flexible and hybrid working schemes to balance study, work, and life
- Professional development events and networking opportunities
- Well-being programs, including Personal Support Service 24/7 - a confidential support channel open to all Nokia employees and their families in challenging situations
- Opportunities to join Nokia Employee Resource Groups (NERGs) and build connections across the organization
- Employee Growth Solutions, mentorship programs, and coaching support for your career development
- A learning environment that fosters both personal growth and professional development – for your role and beyond
Disclaimer for US/Canada
Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.
Join our team as a Mechanical Packaging Engineer Co-op at Nokia, where you'll support the design of advanced packaging components for innovative products using 3D software. Your role involves conducting mechanical integrity and thermal simulations, performing tolerance analyses, and design test fixturing for design validation. You'll apply your knowledge of Design for Manufacturing principles while staying ahead of technological advancements. This position offers a unique chance to grow your skills in a cutting-edge environment, contributing directly to Nokia's mission to drive connectivity and shape the future of technology.
- Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software.
- Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Knowledge of design for manufacturing of 2.5D/3D packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
- Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
- Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
- Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
- Drive package debug activities during product validation and qualification.