Silicon Photonics Packaging Engineer Co-op
Nokia
United States
Posted on Dec 13, 2025
Number of Positions: 2
Duration: 4 months
Date: May 2026 - Aug 2026
Location: Onsite in Sunnyvale, CA, or New York, NY
Education Recommendations
Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.
Advancing connectivity to secure a brighter world.
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
About the Business Group
A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions.
We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running.
Our recruitment process
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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
Some of our benefits for students in the US:
- Flexible and hybrid working schemes to balance study, work, and life
- Professional development events and networking opportunities
- Well-being programs, including Personal Support Service 24/7 - a confidential support channel open to all Nokia employees and their families in challenging situations
- Opportunities to join Nokia Employee Resource Groups (NERGs) and build connections across the organization
- Employee Growth Solutions, mentorship programs, and coaching support for your career development
- A learning environment that fosters both personal growth and professional development – for your role and beyond
Disclaimer for US/Canada
Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.
Join Nokia as a Silicon Photonics Packaging Engineer Co-op, where you'll design innovative optical transceiver packages alongside cross-functional teams to meet critical manufacturing and performance requirements. You'll own and maintain Design Rules documents, conduct simulations and tolerance analyses, and lead package debug activities during product validation. Play a pivotal role in prototype assembly builds, applying your expertise in advanced packaging principles while staying ahead of technological advancements. This unique opportunity allows you to develop semiconductor and optical packaging processes in-house or with partners, driving cutting-edge technology that supports Nokia's mission to advance connectivity.
- Experience with package and process design/development from design to production.
- Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
- Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with thermo-mechanical simulations using ANSYS or similar software.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
We are searching for a Silicon Photonics Packaging Co-op for our Summer 2026 Term to engage in the research and development of silicon photonics transceiver modules.
- Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
- Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
- Own Design Rules documents and ensure Design for Manufacturing specifications are met.
- Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
- Drive package debug activities during product validation and qualification.
- Plan and Drive prototype assembly builds to enable deliveries for early design validation.
- Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.