Silicon Photonics Packaging Co-op/Intern
Nokia
Canada
Posted on Dec 13, 2025
Position Title: Silicon Photonics Packaging Co-op/Intern
Number of Position(s): 1
Duration: 4 Months
Date: May - Aug 2026
Location: Onsite - Ottawa, CA
Education Recommendations
Currently a candidate for a Master's or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in US.
Advancing connectivity to secure a brighter world.
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About the Business Group
A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions.
We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running.
Our recruitment process
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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
Some of our benefits for students in Canada:
- Flexible and hybrid working schemes to balance work and life
- Professional development events and networking opportunities
- Campus perks designed to make your student experience enjoyable and social, such as access to an onsite cafeteria, free employee parking, complimentary fitness centre, and sports facilities (volleyball, basketball, pickleball courts, ping pong, and employee leagues)
- Well-being programs, including Personal Support Service 24/7 – a confidential support channel open to all Nokia employees and their families in challenging situations
- Opportunities to join Nokia Employee Resource Groups (NERGs) and connect with people who share your passions and values
- Employee Growth Solutions, mentorship programs, and coaching support for your career development
- A learning environment that fosters both personal growth and professional development – for your role and beyond
Disclaimer for US/Canada
Nokia maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 3 calendar days and up to 180 days or until candidate/s identified.
Join Nokia as a Silicon Photonics Packaging Engineer Co-op, where you'll design innovative optical transceiver packages alongside cross-functional teams to meet critical manufacturing and performance requirements. You'll own and maintain Design Rules documents, conduct simulations and tolerance analyses, and lead package debug activities during product validation. Play a pivotal role in prototype assembly builds, applying your expertise in advanced packaging principles while staying ahead of technological advancements. This unique opportunity allows you to develop semiconductor and optical packaging processes in-house or with partners, driving cutting-edge technology that supports Nokia's mission to advance connectivity.
- Experience with package and process design/development from design to production.
- Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
- Experience with documentation of fabrication, inspection, and assembly processes.
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Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Knowledge of optical packaging, including epoxies, non-hermetic and high-volume packaging, plus thermal analysis for 2.5D/3D packages.
- Experience in semiconductor back-end processes: chip/wafer assembly and packaging.
Familiarity with high-speed electronics or laser package design. - Skills in thermo-mechanical simulations (e.g., ANSYS) and metrology techniques (SEM/XSEM, confocal microscopy, acoustic imaging).
- Understanding of optical packaging design and simulations using free-space optics or fiber coupling.
- Develop advanced semiconductor and optical packaging processes in-house or with contract manufacturers.
- Design optical transceiver packages in collaboration with cross-functional teams to meet performance and manufacturing requirements.
- Define and maintain Design Rules and ensure compliance with Design for Manufacturing standards.
- Perform mechanical and thermal simulations, tolerance analysis, and characterization.
- Lead package debug activities during validation and qualification phases.
- Plan and execute prototype builds to support early design validation.
- Apply deep knowledge of advanced packaging principles and stay current with emerging technologies.