Internship High speed photodiode for next generation optical system
Nokia
You will be part of the wafer processing team and work in the development of advanced process building blocks for ultra high speed photodiode targeting bandwidth above 100 GHz. Currently, a particular point of attention is at the crossroad of epitaxy (growth of semiconductor layer) and wafer processing (semiconductor definition through etching, metallization, dielectric deposition, passivation,…). In particular the impact of epitaxy method (MOVPE, MBE, nature of P dopent: Zn, Be, C,…) on the performance and the impact of an regrowth on the performance. In relation with an expert team from wafer processing, epitaxy and design team, you will elaborate a plan of experiment and process wafers of photodiode to validate the best processing approach. This will include use of advanced lithography tools, dielectric and metal deposition and etching techniques, and will be followed by advanced characterization through bandwidth measurement
Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Nokia Bell Labs is the world-renowned research arm of Nokia, having invented many of the foundational technologies that underpin information and communications networks and all digital devices and systems. This research has produced nine Nobel Prizes, five Turing Awards and numerous other awards. III-V Lab is an economic interest group between NOKIA, THALES and CEA Leti. You will work as a NOKIA intern inside the THALES TRT building in Palaiseau and be part of the wafer processing team. Our work focusses on fabrication and development of advanced building blocks for lasers, modulators, photodiodes and optical amplifiers and their integration into complex photonic integrated circuit (PIC) a preamplified receiver for future optical access network. At the III-V Lab you will have the opportunity to see all the manufacturing steps under the same roof: epitaxy, processing, packaging and characterization.
You are:
• Student in master 2 or last year of engineer school or equivalent
• Available fulltime for 5 to 6 months
• With a background in physics, chemistry, micro-engineering, optics or a related discipline
• Interested for experimental work, meticulous
Would be good if you also have:
• Knowledge on cleanroom semiconductor manufacturing
• Communication and writing skills
Are you passionate about solving problems? As part of our team, you will mainly work inside a cleanroom:
• Improve the current manufacturing process and develop new building blocks
• Learn to operate a wide range of tools used in semiconductor industry like stepper lithography, dry/wet etching and characterization
• Participate in the design of manufacturing processes for photonic integrated circuit
• Contribute to the manufacturing and measurement of ultra high speed (>100 GHz) photodiode