Packaging Development Engineer
Nokia
Other Engineering
United States
Posted on Oct 16, 2025
Packaging Development Engineer
United States (Hybrid)
Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!
Your responsibilities
- Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
- Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo compression bonding, underfill, hot bar soldering, etc…
- Optimize the assembly of electrical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
- Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
- Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
- Drive package debug activities during product validation and qualification.
- Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.
Your skills and experience
You have:
- 4 -5 years of experience. Experience in high-speed electronics and Silicon Photnics package design.
- Experience with flip chip, fanout, thermo compression bonding, underfill, hot bar soldering. Experience in microelectronics, optoelectronics packaging design and assembly.
- Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
- Experience with package and process design/development from design to production.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
It would be nice if you also had:
- Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis). Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc. Expertise in high-volume packaging of 2.5/ 3D packages. Knowledge of material properties and associated mechanical part fabrication processes. Familiar with optical coupling, fiber pigtail and free space optics.
More information
Some of our benefits in US:
- Corporate Retirement Savings Plan
- Health and dental benefits
- Short-term disability, and long-term disability
- Life insurance, and AD&D – Company paid 2x base pay
- Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
- Paid time off for holidays and Vacation
- Employee Stock Purchase Plan
- Tuition Assistance Plan
- Adoption assistance
- Employee Assistance Program/Work Life Resource Program
The above benefits exclude students.
Disclaimer for US/Canada
Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.
All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.
About Us
About Nokia
Join us in creating the technology that helps the world act together.
We are a B2B technology innovation leader, pioneering networks that sense, think and act™, putting the world’s people, machines and devices in sync to create a more sustainable, productive and accessible future.
About the Business Group
A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions.
We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running.
Our recruitment process
We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.
Job Info
- Job Category Applied R&D
- Posting Date 10/15/2025
- Locations 520 Almanor Avenue, Sunnyvale, California, 94085, US 171 Madison Avenue, New York, New York, 10016, US (Hybrid)
- Degree Level Master’s degree
- Job Schedule Full time
- Job Type Experienced
- Job Identification 25458
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