RFIC Design Research Intern

As a RFIC Design Researcher in High-Speed/mm-Wave ASICs & Systems Research at Nokia, you will spearhead the development of cutting-edge integrated circuits for next-generation communication systems, including 5G/6G and coherent optical links. By collaborating with Bell Labs researchers and various Nokia divisions, your work will push the boundaries of wireless technology, enabling seamless connectivity and innovation. This role is pivotal in shaping future communication capabilities, directly supporting Nokia's mission to connect people and devices with advanced, high-performance solutions that drive the digital transformation of industries worldwide.

Join Nokia Bell Labs as a student researcher and help pioneer the next generation of IC packaging solutions. In this role, you’ll explore innovative packaging architectures and high-performance materials to push the boundaries of millimeter-Wave, Terahertz, and optical technologies. Working alongside a cross-functional Bell Labs R&D team and Nokia business units, you’ll design, simulate, and characterize cutting-edge semiconductor packaging solutions, while identifying key opportunities for innovation in advanced materials. This position offers a unique opportunity to contribute to transformative research shaping the future of high-frequency communications and beyond.

Our Optical Networks Business Division is searching for a Senior RFIC Design Engineer (analog and mixed-signal IC designers) to contribute to the design of high-speed drivers, TIAs and control systems for optical communication applications.

Join Nokia Bell Labs as a Thermo-Mechanical Intern and contribute to the design of advanced hardware solutions for next-generation wireless systems. In this role, you’ll work alongside Bell Labs researchers and engineers to develop thermal and mechanical designs that support radio systems operating in mm-Wave and THz frequencies for 6G and beyond. Your work will include performing simulations, tolerance analyses, and material characterization, spanning from semiconductor packaging to enclosure-level design. This internship is an excellent opportunity to apply your expertise, collaborate across multidisciplinary teams, and make an impact on the future of wireless technology.

Join Nokia Bell Labs as a student researcher and contribute to groundbreaking work in RFIC packaging and electromagnetic passive components. In this role, you’ll explore novel architectures, interconnects, and antennas for mm-Wave and near-THz applications. You’ll work hands-on to design, simulate, and characterize advanced RF hardware using both established and emerging technologies, collaborating closely with Bell Labs researchers and Nokia business units. This position offers the opportunity to develop innovative solutions that will drive the future of high-performance communications in the mm-Wave and near-THz spectrum.

As a Research Co-op/Intern you will work with an experienced team on the upcoming next generation of Wi-Fi technology. You will develop and evaluate novel concepts, present them to the team and prepare contributions to the IEEE 802.11 or Wi-Fi Alliance standardization. Your work will have an impact on Nokia's Wi-Fi research and will potentially be used in billions of devices running Wi-Fi 8 and beyond.