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Job Description:

Reporting to Wafer Foundry R&D manager in Rousset and collaborate with team members in France and the United States (Reading, Tempe & San Jose).

As a device engineer, you will be part of the R&D team in charge of technology transfer, enhancement, and development projects running in internal and foundry wafer FAB’s.

· Work with Design Fab and Product Engineering in yield enhancement, circuit, and device optimization especially on BCD and e-NVM technologies

· Analyze device parameters and correlate drifts to FAB related process parameters.

· Support the team with process mask generation files and new design IP creation for different Microchip owned technologies

· Generate new test keys structures align with new devices introduction on the technology to monitor the process flow

· Run design/layout and process experiments for optimum semiconductor device performance.

· Use various troubleshooting techniques to isolate and solve technical issues with devices and processes.

· Work with failure analysis groups on field failures and customer returns to quickly isolate the problem and implement corrections.

· Present data, results, and conclusions in the technical team meeting.

Requirements/Qualifications:

Competencies

• Microelectronic basis skills: Wafer Fabrication, Device Physics and simulations

• Familiar with Unix environment and with Cadence tools

• Interpersonal skills: self-motivated, involved in the work, good communication and teamwork.

• Fluent verbal and written communication skills in English and French

The New College Grade (NCG) Candidate (less than 2 years of experience) must have a master’s degree or PhD with major emphasis on Semiconductor Devices.

Travel Time:

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.