Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.
Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.
Keysight is at the forefront of technology innovation, delivering breakthroughs in electronic design, simulation, test, manufacturing, and optimization. With ~15,000 employees supporting customers in over 100 countries, Keysight provides industry-leading solutions across communications, HPC, quantum, aerospace, defense, automotive, and semiconductor markets.
Within Keysight’s Quantum Engineering Solutions (QES) division, we are advancing the control infrastructure that powers next-generation quantum computing. Building on our recent success delivering a 1,000-qubit quantum control system, we are now developing a high-density, HPC/datacenter-ready portfolio of quantum control products ranging from compact modules to fully integrated rack-level systems.
We are seeking a Mechanical Engineer who will contribute to mechanical architecture, packaging design, and system-level development for this next-generation quantum control product family. This role covers concept development, design, analysis, testing, and collaboration with multidisciplinary engineering teams. Candidates with strong mechanical engineering skills and interest in advanced electronic systems are highly encouraged to apply—even if they do not meet every listed qualification.
This is a unique opportunity to influence the physical design of quantum computing infrastructure and work with leading experts across mechanical, electrical, thermal, and system engineering.
Responsibilities
• Contribute to mechanical and electro-mechanical design for Keysight’s next-generation quantum control systems, from early concepts through production release.
• Participate in the development of high-density mechanical platforms designed for HPC/datacenter environments, including rack-ready enclosures, modular assemblies, and service-friendly designs.
• Support the development of thermal management solutions—including liquid cooling, airflow optimization, heat exchangers, heat pipes, and cold plates—for high-power, high-channel-count control electronics.
• Perform engineering analyses (thermal, structural, airflow, manufacturability) and provide input to guide design decisions.
• Create 3D CAD models, engineering drawings, and documentation following ANSI standards.
• Assist with validation and verification activities, including prototype testing for thermal performance, vibration, and long-term reliability.
• Work closely with electrical, RF/uW, FPGA, firmware, and software teams to ensure smooth integration across all system elements.
• Collaborate with internal and external manufacturing teams to support DFM, DFT, assembly processes, and supplier engagement.
• Research new materials, fabrication methods, and mechanical technologies that can improve performance, manufacturability, or cost.
• Contribute to long-term mechanical design strategy for scalable quantum control product development.
Qualifications
- BS degree in Mechanical Engineering or related field; MS degree preferred.
• Experience in electro-mechanical design, electronics packaging, or complex mechanical systems (experience with high-density or rack-mounted systems is a plus).
• Knowledge of thermal management methods such as airflow design, liquid cooling, heat pipes, cold plates, or related technologies.
• Proficiency with 3D CAD tools (SolidWorks required) and familiarity with ANSI drafting standards.
• Experience with common fabrication processes (sheet metal, machined parts, plastics, extrusions).
• Ability to perform mechanical or thermal simulations (SolidWorks Flow Simulation or similar is a plus).
• Familiarity with HPC/datacenter equipment, server packaging, networking hardware, or industrial electronics is helpful but not required.
• Hands-on prototyping and debugging skills; comfortable using common bench tools and test equipment.
• Strong communication skills and ability to collaborate across disciplines in a fast-paced R&D environment.
• Fluency in both Japanese and English (written and spoken) is required to collaborate effectively with local teams and global R&D groups.
• Highly organized, detail-oriented, and eager to contribute to advanced technology development.
• Experience with reliability and environmental testing (thermal cycling, vibration, shock) is a plus.
Candidates who meet many—but not necessarily all—of the above qualifications are encouraged to apply.
We value strong mechanical engineering fundamentals, willingness to learn, and the ability to grow into the full scope of the role.
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