Master Thesis: New Air Guide Design for Indoor RAN Compute Products
Ericsson
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About this opportunity:
Are you ready to apply your engineering skills to redesign critical mechanical components for sustainable and high-performance telecom hardware? This Master’s Thesis focuses on developing a new design for the upper and lower air guides in indoor RAN Compute products, with the goal of improving thermal performance, robustness, and aesthetics while enhancing manufacturability, repairability, and sustainability. By rethinking the heatsink and cover assembly, you will explore innovative material choices, ultra-thin yet durable cover designs, and alternative fastening solutions that simplify production without compromising serviceability.
What you will do:
• Collaborate with Mechanical, Thermal, Quality, and Producibility Engineering teams to gather design requirements
• Investigate and compare alternative materials and finishes for durability, manufacturability, sustainability, weight, and cost
• Assess and test fastening techniques beyond conventional screws and rivets for faster, secure, repairable assemblies
• Create CAD models and detailed engineering drawings of proposed concepts
• Perform comparative analyses for cost, manufacturability, embodied carbon, mechanical integrity, and thermal performance
• Present mechanical design proposals for new air guide assemblies
• (Optional) Run thermal simulations to verify cooling performance under diverse conditions
• Support prototype manufacturing and assist in testing to validate robustness and thermal efficiency
The skills you bring:
• MSc studies in Mechanical Engineering, Industrial Design Engineering, Materials Science, or similar fields
• Proficiency in CAD design tools and mechanical drawing standards
• Knowledge of material properties, manufacturing processes, and fastening methods
• Analytical skills for comparing performance and cost trade-offs
• Meriting: Experience in thermal simulation, plastics/metal forming, and sustainable material selection
Your work will directly impact sustainable, repairable, and efficient telecom hardware, driving innovation in the RAN Compute product segment.
Why join Ericsson?
At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.
What happens once you apply?
Click Here to find all you need to know about what our typical hiring process looks like.
Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.
Primary country and city: Sweden (SE) || Stockholm
Req ID: 773294